Ua PCB - Xov xwm - Shenzhen Fumax Technology Co., Ltd
micro chip scanning

Fumax Tech muaj qhov zoo tshaj plaws Printing Circuit Boards (PCB) nrog rau ntau txheej PCB (luam tawm Circuit Board), qib siab HDI (siab ceev inter-connector), arbitrary-txheej PCB thiab rigid-flexible PCB ... thiab lwm yam.

Raws li cov khoom siv hauv paus, Fumax nkag siab qhov tseem ceeb ntawm kev txhim khu kev qha zoo ntawm PCB.Peb nqis peev hauv cov cuab yeej zoo tshaj plaws thiab pab neeg muaj peev xwm los tsim cov khoom zoo tshaj plaws.

Cov pawg PCB raug raws li hauv qab no.

Rigid PCB

Flexible & Rigid Flex PCBs

HDI PCB

High zaus PCB

High TG PCB

LED PCB

Hlau Core PCB

Thick Cooper PCB

Aluminium PCB

 

Peb lub peev xwm tsim khoom tau qhia hauv daim duab hauv qab no.

Hom

Muaj peev xwm

Scope

Multilayers (4-28), HDI (4-20) Flex, Rigid Flex

Ob Sab

CEM-3, FR-4, Rogers RO4233, Bergquist Thermal Clad 4mil-126mil (0.1mm-3.2mm)

Multilayers

4-28 txheej, board thickness 8mil-126mil (0.2mm-3.2mm)

faus/dab muag Via

4-20 txheej, board thickness 10mil-126mil (0.25mm-3.2mm)

HDI

1 + N + 1, 2 + N + 2, 3 + N + 3, Txhua txheej

Flex & Rigid-Flex PCB

1-8layers Flex PCB, 2-12layers Rigid-flex PCB HDI + Rigid-flex PCB

Laminate

 

Soldermask Hom (LPI)

Taiyo, Goo's, Probimer FPC ....

Peelable Soldermask

 

Carbon number case

 

HASL/Lead Free HASL

Thickness: 0.5-40um

OSP

 

ENIG (Ni-Au)

 

Electro-bondable Ni-Au

 

Electro-nickel palladium Ni-Au

Au: 0.015-0.075um Pd 0.02-0.075um Ni: 2-6umm

Hluav taws xob.Hard kub

 

tuab tin

 

Muaj peev xwm

Kev tsim khoom loj

Min Mechanical Laum Qhov

0.20 hli

Min.Laser Laum Qhov

4mil (0.100 hli)

Kab Dav/Spacing

2 mil/2 mil

Max.Vaj Huam Sib Luag Loj

21.5 "X 24.5" (546mm X 622mm)

Kab Dav/Spacing kam rau ua

Tsis yog electro txheej: +/- 5um, Electro txheej: +/- 10um

PTH Hole Tolerance

+/- 0.002 nti (0.050mm)

NPTH Hole Tolerance

+/- 0.002 nti (0.050mm)

Qhov Chaw Nyob Tolerance

+/- 0.002 nti (0.050mm)

Qhov rau Edge Tolerance

+/- 0.004 nti (0.100mm)

Ntug rau Ntug Tolerance

+/- 0.004 nti (0.100mm)

Layer to Layer Tolerance

+/- 0.003 nti (0.075 hli)

Impedance kam rau ua

+/- 10%

Warpage%

Max ≤0.5%

Technology (HDI khoom)

Yam khoom

Ntau lawm

Laser Ntawm Drill/Pad

0.125/0.30, 0.125/0.38

Qhov muag tsis pom ntawm Drill/Pad

0.25/0.50 Nws

Kab Dav/Spacing

0.10/0.10 Nws

Txoj Kev Tsim Nyog

CO2 Laser Direct Laum

Tsim Cov Khoom Siv

FR4 LDP(LDD);RCC 50 ~ 100 micron

Cu Thickness ntawm Qhov Phab Ntsa

Qhov muag qhov muag: 10um (min)

Aspect Ratio

0.8:1 ib

Technology (Flexible PCB)

Qhov project

Muaj peev xwm

Roll rau yob (ib sab)

YOG

Roll rau yob (ob npaug)

NO

Volume rau yob cov khoom dav mm

250

Yam tsawg kawg nkaus ntau lawm mm

250 x 250

Ntau qhov ntau thiab tsawg mm

500 x 500

SMT Sib dhos thaj (Yog / Tsis yog)

YOG

Air Gap peev xwm (Yog / Tsis yog)

YOG

Kev tsim cov tawv thiab mos khi phaj (Yog / Tsis yog)

YOG

Max txheej (Hard)

10

Qhov siab tshaj plaws (Soft phaj)

6

Material Science 

 

PI

YOG

PET

YOG

Electrolytic tooj liab

YOG

Rolled Anneal Copper Foil

YOG

PI

 

Npog zaj duab xis alignment kam rau ua mm

± 0.1

Tsawg kawg npog zaj duab xis mm

0.175 ib

Kev txhawb zog 

 

PI

YOG

FR-4

YOG

Lawv

YOG

EMI SHIELDING

 

Nyiaj Ink

YOG

Zaj duab xis nyiaj

YOG