Fumax Tech muaj qhov zoo tshaj plaws Printing Circuit Boards (PCB) nrog rau ntau txheej PCB (luam tawm Circuit Board), qib siab HDI (siab ceev inter-connector), arbitrary-txheej PCB thiab rigid-flexible PCB ... thiab lwm yam.
Raws li cov khoom siv hauv paus, Fumax nkag siab qhov tseem ceeb ntawm kev txhim khu kev qha zoo ntawm PCB.Peb nqis peev hauv cov cuab yeej zoo tshaj plaws thiab pab neeg muaj peev xwm los tsim cov khoom zoo tshaj plaws.
Cov pawg PCB raug raws li hauv qab no.
Rigid PCB
Flexible & Rigid Flex PCBs
HDI PCB
High zaus PCB
High TG PCB
LED PCB
Hlau Core PCB
Thick Cooper PCB
Aluminium PCB
Peb lub peev xwm tsim khoom tau qhia hauv daim duab hauv qab no.
| Hom | Muaj peev xwm |
| Scope | Multilayers (4-28), HDI (4-20) Flex, Rigid Flex |
| Ob Sab | CEM-3, FR-4, Rogers RO4233, Bergquist Thermal Clad 4mil-126mil (0.1mm-3.2mm) |
| Multilayers | 4-28 txheej, board thickness 8mil-126mil (0.2mm-3.2mm) |
| faus/dab muag Via | 4-20 txheej, board thickness 10mil-126mil (0.25mm-3.2mm) |
| HDI | 1 + N + 1, 2 + N + 2, 3 + N + 3, Txhua txheej |
| Flex & Rigid-Flex PCB | 1-8layers Flex PCB, 2-12layers Rigid-flex PCB HDI + Rigid-flex PCB |
| Laminate |
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| Soldermask Hom (LPI) | Taiyo, Goo's, Probimer FPC .... |
| Peelable Soldermask |
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| Carbon number case |
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| HASL/Lead Free HASL | Thickness: 0.5-40um |
| OSP |
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| ENIG (Ni-Au) |
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| Electro-bondable Ni-Au |
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| Electro-nickel palladium Ni-Au | Au: 0.015-0.075um Pd 0.02-0.075um Ni: 2-6umm |
| Hluav taws xob.Hard kub |
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| tuab tin |
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| Muaj peev xwm | Kev tsim khoom loj |
| Min Mechanical Laum Qhov | 0.20 hli |
| Min.Laser Laum Qhov | 4mil (0.100 hli) |
| Kab Dav/Spacing | 2 mil/2 mil |
| Max.Vaj Huam Sib Luag Loj | 21.5 "X 24.5" (546mm X 622mm) |
| Kab Dav/Spacing kam rau ua | Tsis yog electro txheej: +/- 5um, Electro txheej: +/- 10um |
| PTH Hole Tolerance | +/- 0.002 nti (0.050mm) |
| NPTH Hole Tolerance | +/- 0.002 nti (0.050mm) |
| Qhov Chaw Nyob Tolerance | +/- 0.002 nti (0.050mm) |
| Qhov rau Edge Tolerance | +/- 0.004 nti (0.100mm) |
| Ntug rau Ntug Tolerance | +/- 0.004 nti (0.100mm) |
| Layer to Layer Tolerance | +/- 0.003 nti (0.075 hli) |
| Impedance kam rau ua | +/- 10% |
| Warpage% | Max ≤0.5% |
Technology (HDI khoom)
| Yam khoom | Ntau lawm |
| Laser Ntawm Drill/Pad | 0.125/0.30, 0.125/0.38 |
| Qhov muag tsis pom ntawm Drill/Pad | 0.25/0.50 Nws |
| Kab Dav/Spacing | 0.10/0.10 Nws |
| Txoj Kev Tsim Nyog | CO2 Laser Direct Laum |
| Tsim Cov Khoom Siv | FR4 LDP(LDD);RCC 50 ~ 100 micron |
| Cu Thickness ntawm Qhov Phab Ntsa | Qhov muag qhov muag: 10um (min) |
| Aspect Ratio | 0.8:1 ib |
Technology (Flexible PCB)
| Qhov project | Muaj peev xwm |
| Roll rau yob (ib sab) | YOG |
| Roll rau yob (ob npaug) | NO |
| Volume rau yob cov khoom dav mm | 250 |
| Yam tsawg kawg nkaus ntau lawm mm | 250 x 250 |
| Ntau qhov ntau thiab tsawg mm | 500 x 500 |
| SMT Sib dhos thaj (Yog / Tsis yog) | YOG |
| Air Gap peev xwm (Yog / Tsis yog) | YOG |
| Kev tsim cov tawv thiab mos khi phaj (Yog / Tsis yog) | YOG |
| Max txheej (Hard) | 10 |
| Qhov siab tshaj plaws (Soft phaj) | 6 |
| Material Science |
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| PI | YOG |
| PET | YOG |
| Electrolytic tooj liab | YOG |
| Rolled Anneal Copper Foil | YOG |
| PI |
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| Npog zaj duab xis alignment kam rau ua mm | ± 0.1 |
| Tsawg kawg npog zaj duab xis mm | 0.175 ib |
| Kev txhawb zog |
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| PI | YOG |
| FR-4 | YOG |
| Lawv | YOG |
| EMI SHIELDING |
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| Nyiaj Ink | YOG |
| Zaj duab xis nyiaj | YOG |